We seek to analyze the effect of the glass chemical composition and the laser writing parameters on the thermal stability of the imprinted optical properties.On the one hand, we tentatively reveal the underlying mechanisms at the origin of the observed birefringence and their entanglement in bulk silicate glasses: oriented point defects, stress fields from several contributions, nanostructures and texturation, etc. thesis is to figure out the relationship between different type of modifications induced by fs laser in glasses and fibers (particularly silica and aluminosilicate) that are fabricated by various methods, and make the link between chemistry of materials and femtosecond laser-induced transformations. These structural modifications could be an ideal support to imprint various optical functions that could withstand high temperature operation.In this context, the objectives of this Ph.D. Thermal stability of these devices may therefore be achieved by judicious application of glass preparation, glass annealing and glass laser irradiations.From a fundamental point of view, femtosecond laser direct writing allows to take profit of light forces that act on the plasma and its nanostructuring leading to the nucleation - growth of nanocavities or even nanocrystals depending on the chosen compositions. The key enablers to meet these requirements are related to the intrinsic nature of the glass material that composes the devices, and more specifically its glass structure and associated properties such as viscous flow, chemical migration, and stress relaxation. Of particular relevance, these devices include live diagnostics with embedded optical sensor composites for aircraft, helicopters, and space infrastructure, temperature/pressure sensing in increasingly deeper and hotter oil bores, or again monitoring and mapping of temperature distribution in power plants, furnaces, and chemical reactors. A new generation of devices that operate in extreme environments (particularly those operating above 700☌ and up to 1500☌), including environments with additional challenges such as radiation and intense optical fields (e.g., high power lasers), must be capable of withstanding gradual annealing and degradation, or aging, over time. Good thermal and electrical conductivityįor more information about Durafuse ™ LT, please download our product data sheet.Harsh environmental sensing using optical fiber technologies is a rapidly growing field of research.Good mechanical shear strength up to 150-165 ☌.Excellent drop shock reliability – comparable to SAC.Durafuse LT ™ is ideal for high-reliability applications which utilize thermally sensitive components. The SnInAg alloy initiates joint fusion while the SAC alloy provides enhanced strength and durability. The required peak reflow temperature is under 210 ☌. Durafuse ™ LT is made up of a low-melting indium-containing alloy and a higher-melting SAC alloy. Durafuse ™ LT provides improved drop shock resilience, outclassing bismuth-tin (BiSn) or bismuth-tin-silver (BiSnAg) alloys, and performing better than SAC305 with optimum process setup. Read Moreĭurafuse ™ LT is a patented two temperature alloy system designed to provide high-reliability in low-temperature applications. It so effectively resists corrosion that gold is plated over metals like copper when contact. Read More Metals That "Melt" Other Metalsįolks, Gold is often used to protect other metals from corrosion. Read More How to Calculate the Metal Mass Fractions in a Two-Metal Alloy Systemįolks, I was surprised to see the wrong formula for metal alloy density calculations on YouTube. ![]() Read More Excel Software Tool to Determine Mass Fractions in Binary Alloyįolks, Recently, I posted a derivation of the equations to determine the mass fractions of two metals in a binary alloy. Read More Low-Temperature Solder for Environmental SustainabilityĪs energy consumption has become increasingly important-in terms of cost, availability, and environmental impact-it is about time we use quantitative data to consider carbon emissions and oven energy consumption to make process decisions. In the world of electronics assembly, the utilization of high-quality alloys is critical to a successful product, and is verified through accurate and precise a. SiP & Heterogeneous Integration & Assembly (HIA)Ĭlose Related Solder Alloys Blog Articles Compositional Analysis of Metals by ICP-OES: Some Basics. ![]()
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